Suneal Ghataora, Sanger Hsu, Rick Smith, Simon Jones
About
Pixel-Flo
Pixel-Flo is developing an entirely new process for microLED mass transfer — the critical barrier to making microLED displays available at mass market price points. When researching microLEDs at the University of Sheffield, Dr Rick Smith and Dr Suneal Ghataora realised that the amazing potential of microLED displays will never be met using conventional 'pick and place' mechanical assembly methods.
The challenge of placing millions of LED die to micron level accuracy over large substrates at extremely high yield is just too great, and likely to prevent the adoption of microLED in anything but niche applications. In recognition of the fundamental limits of mechanical transfer, the industry had started to look at fluidic self-assembly for microLED mass transfer. However, these early approaches brought their own issues related to die placement and to achieving high throughput and yield.
Rick and Suneal's inspiration was to adapt an industry standard coating method to develop an industrially scalable fluidic self-assembly approach. The slot-die based process uses meniscus forces to continuously guide the microLEDs into place. It is backplane-agnostic and enables a single step for RGB.
Together with Simon Jones they founded Pixel-Flo to commercialise this unique approach as Continuous-Flo™. The company was spun-out from the University of Sheffield in 2025. Pixel-Flo announced initial equity funding of £5.25M in July 2026 led by Northern Gritstone, SCVC, High-Tech Gründerfonds and Parkwalk's Northern University Venture Fund.
How Mechanical Mass Transfer is
Holding Back MicroLED
The Solution
The three step Continuous-Flo process represents a major simplification of mass transfer for microLED displays:
Known good LED die are released into an ink.
Unlike mechanical systems, no die are lost due to the mismatch between the round LED wafer and a square carrier, and there is no 'stamp mura' as the die are randomised in the ink.
LED locations, or traps, are patterned on the substrate.
This uses standard photolithographic equipment and materials already present in the array line to achieve micron level placement accuracy.
The LED die are assembled into the traps using an adapted slot-die process.
Pixel-Flo's meniscus guiding technique creates an extremely high interaction rate between the die and the traps allowing a fast throughput.
Continuous assembly of microLED die on the substrate using meniscus guiding
With Continuous-Flo™, unit cost reduces with increasing substrate size due to the fundamental scalability of slot-die. Additionally, smaller die can be assembled than is possible with mechanical systems enabling significant cost reductions in materials.
The Team
Careers at Pixel-Flo
We are growing fast and would love to hear from anyone with the skills and ambition to join the team that is helping shape the future of the display industry. Please email your CV and a cover letter to [email protected]
Don't see a role that fits? We welcome speculative applications — get in touch.
Get in Touch
Questions or Comments? Send us a message, and we will get back to you soon.
[email protected]